3D TSV packaging news from Alchimer

Now for some packaging news that’s even inspiring. At SEMICON West 2009, Alchimer, a Massy, France company, will launch their third product: AquiVia, a process used for wet deposition of the insulation and barrier layers inside high-aspect ratio TSVs. AquiVia eliminates dry process techniques from TSV metallization.
Using AquiVia, conformal, uniform insulation and barrier layers can be produced inside a TSV with aspect ratios at 10:1. Combined with Alchimer's eG ViaCoat product, which creates conformal copper seed layers, the same tool can be used for the deposition of insulation, barrier, and seed layers. “This latest breakthrough is predicted to eliminate all dry processing techniques from TSV metallization, cutting the cost of ownership of the via stack metallization by more than 70%,” said Steve Lerner, president and CEO. This is the same product, eG ViaCoat, that won the Best of the West award at SEMICON last year. Look out!