2009 proves to be a year of flux in all areas of electronics. Let's avoid confusion and take them in order: BiTS (sockets), IMAPS Packaging (3D TSV packages), APEX (board assembly), and SEMICON West (wafer to backend packaging), the major shows in the US and see what's coming up.
At BiTS Workshop in Mesa, AZ, the most important event for burn-in socket design, Brandon Prior, Sr. Consultant of Prismark Partners IC packaging solutions, kicks it off by talking about how packages have been evolving in many ways that were forecast. In some ways packages are moving in ways not predicted by any analysts. His presentation will look at the recent trends of IC packages in terms of package type, pitch, and integration for multi-chip and 3D solutions. In preparing for the next decade of innovations, he provides a forecast for current advanced packages, and looks into future developments in 3D and package integration that may have an impact on overall test strategies and challenges going forward. If it touches on burn-in test sockets and how they will correspond with 3D, this will be the place to catch everything.
IMAPS big event is the packaging area is the 4th International Conference and Exhibition on Device Packaging to be held in Scottsdale, AZ. This will be focused on the challenges and technologies for packaging and devices of all types. The format has expanded again this year, now featuring six workshops concentrating on: 3D packaging; flip chip technologies; wafer-level packaging/CSP; MEMS and associated microsystems; electronic packaging for medical devices; and new this year, packaging of power LED devices. These workshops are a continuation of past IMAPS Advanced Technology Workshops. If you attend BiTS, you might as well include the IMAPS packaging workshops, since they're in the same Phoenix-central area.
And what about IPC's APEX? This technical conference is known worldwide as one of the finest shows around. In the US especially, this is the place to take advantage of new research and innovations from key industry players in the areas of board fabrication and design and electronics assembly. New sessions this year include a focus on moisture sensitivity, high- temperature processing, die attach, and green electronics. That's in addition to their annual focus on the key areas of soldering, advanced packaging, materials and reliability. New research and innovations from key industry players in the areas of board fabrication and design and electronics assembly or old issues of moisture sensitivity,high temperature processing, die attach, and the environment.
This may be a slow or negative year in many aspects, but technology breakthroughs wait for no one.
SEMICON West can wait until tomorrow.
-G
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Miss Flower,
ReplyDeleteI have been following your articles for quite some time. I would just like to wish you all the best with your future endeavors. Keep up the great work.
"Trade shows", at least in the electronics manufacturing industry, are in for a bit of a shake up.
ReplyDeleteIn our industry, trade show exhibitors end up footing much of the bill for these events. But, as you note, customers tend to participate in such events primarily for the technical aspect. The exhibits are no longer the place to announce product or technology breakthroughs (that's what websites, emails, SMSs, and word of mouth are for - as I noted in a recent comment on EMSPeople). By the time a trade show comes around, the news is out. What customers seem to be most interested in is hearing tech papers being delivered, being talked through the slides and the concepts, meeting the presenters and researchers, and discussing the topics with peers face to face.
What suppliers are most interested in is increasing sales, profits, market share, and image via being seen as the most valuable purchasing option.
So, how do we retain (even enhance) our tech conferences while ditching the exhibitions? It all boils down to money. The two basic parties involved are the suppliers and the consumers - so it's got to come from one or both sources. Since both parties benefit, it makes sense to share the expense. But how should the pie be divided? I suggest we, "follow the value".
In other words:
1) the customer has to start paying their
fair share for such events
2) the supplier has to deliver true value (not re-treaded leftovers from last year)
3) when customers deliver value, the suppliers need to recognize that
4) it all needs to be boiled down, somehow, and the costs should be allocated fairly (based on value delivered and value gained.
I wish I had a clearer, actionable view of exactly how this could happen.